

Design and Mechanical Data
Substrate Material : P-Ge
Base Material : GaInP/GaAs/Ge
Thickness : 150μm±20μm
Welding Method : Weld or Solder
AR-coating : TiO x /Al 2 O 3
Coverglass : KFG120
Coverglass thickness : 120μm
CICs Size : 40.1+0.050mm × 80.1+0.050mm
CICs thickness : 300±25μm
Interconnector thickness : 30μm
Average Weight : ≤115mg/cm 2
Bypass Protect : Si Diode
Extra option:1. Different thickness coverglasses can be customized.
2. ITO coverglass available.


